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焊点可靠性,POP组装与空洞控制培训班

【时间地点】 2012年8月25-26日 深圳
【培训讲师】 李宁成
【参加对象】 凡对电子封装和组装应用中实现焊点高可靠性(特别是对PoP封装)感兴趣的,并想了解如何实现的焊点高可靠性的人员均可参加本课程
【参加费用】 ¥2500元/人 (含资料费、授课费、午餐)
【会务组织】 森涛培训网(www.stpxw.com).广州三策企业管理咨询有限公司
【咨询电话】 020-34071250;020-34071978(提前报名可享受更多优惠)
【联 系 人】 庞先生,邓小姐;13378458028、18924110388(均可加微信)
【在线 QQ 】 568499978 培训课纲 课纲下载
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培训关键词:焊点培训,POP组装培训,空洞控制培训

焊点可靠性,POP组装与空洞控制培训班(李宁成)课程介绍:

您能从此课程中学到哪些内容:
本课程涵盖了电子封装和组装应用中软钎焊焊点的可靠性表现。讨论了焊点的机械失效模式机制和提高可靠性的方法。在电可靠性方面,详细讨论了由于微型化的快速发展而导致的严重的焊点,铜柱以及再分布线的电迁移问题。在组件类型方面,详尽地回顾了POP以及其他的底部终止组件封装方式,包括材料选择,工艺,可靠性,和提高可靠性的方法。介绍了环氧助焊剂这种最具潜力的解决方法,并将其与其他解决方案进行比较。最后,以QFN热板设计为实例,讲授了回流焊中,特别是在PoP和其他更容易产生气孔的封装方式中气孔控制方法。这些控制方法包括在材料,工艺和设计方面的考虑。
What You Can Learn From This Course:
This course covers the solder joint reliability performance for packaging and assembly applications. The mechanism of joint mechanical failure modes and approaches for improving reliability will be discussed. As to the electrical reliabilities, electromigration will be discussed in great details on solder, Cu pillar, and redistribution line due to the rapid advancement of miniaturization and the resultant serious electromigration problems. Regarding the component type, Package on package (PoP) as well as other bottom-terminated components will be reviewed thoroughly, including materials selection, processes, reliabilities, and approaches of enhancing the reliability. Being the solution with the highest potential, epoxy flux will be introduced and will be compared with other solutions. Finally, voiding control at reflow soldering, particularly at PoP and other packages more prone to have voids, will be instructed. The control includes considerations from materials, processes, and designs, with QFN thermal pad design serving as a demonstration on control.

谁应该参加此课程:
凡对电子封装和组装应用中实现焊点高可靠性(特别是对PoP封装)感兴趣的,并想了解如何实现的焊点高可靠性的人员均可参加本课程
Who Should Take This Course:
Any one who care about achieving high reliability solder joints for packaging and assembly applications, particularly that of PoP, and like to know how to achieve it should take this course.

老师介绍:李宁成
Ning-Cheng Lee,1973国立台湾大学化学专业学士,1981年University of Akron高分子专业博士,现任美国Indium 公司技术副总裁。Ning-Cheng Lee博士于1986 年加入Indium 公司,在此之前,曾先后就职于莫顿化学公司 和SCM 公司。他对于SMT 行业中助焊剂和焊膏的研发有20 多年的经验,并在底部填充灌封胶和粘合剂的研发方面也具有极为丰富的经验。
Ning-Cheng Lee博士编写了 《Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies》(Newnes出版)一书,参与编写了《Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials》(McGraw-Hill出版),同时还编写了一些无铅焊接书籍的部分章节。他于1991年获SMT杂志颁发的最佳SMI国际研讨会论文奖,1993年和 2001年获SMTA颁发的最佳SMTA国际研讨会论文奖,2008年获IPC在美国APEX会议上颁发的优秀论文奖, 2010年获SMTA China South颁发的最佳论文奖,2002年,被提名为SMTA的荣誉会员,2003年获Soldertec全球无铅焊料奖, 2006年获CPMT杰出技术成就奖,2007年CPMT杰出讲师,2009年SMTA杰出作者,2010年获CPMT电子制造技术奖。Ning-Cheng Lee博士还是SMTA董事会成员,并担任《Soldering and Surface Mount Technology》和《Global SMT & Packaging》杂志的编辑顾问,《IEEE Transactions on Electronics Packaging Manufacturing》的助理主编。他发表过大量的文章,经常应邀参加国际论坛研讨会并对一些研究成果做简短的介绍或者重要的演讲。
Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 20 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973.
Ning-Cheng is the author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies” by Newnes, and co-author of “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials” by McGraw-Hill. He is also the author of book chapters for several lead-free soldering books. He received 1991 award from SMT Magazine and 1993 and 2001 awards from SMTA for best proceedings papers of SMI or SMTA international conferences, 2008 award from IPC for Honorable Mention Paper – USA Award of APEX conference, and Best Paper Award of SMTA China South 2010. He was honored as 2002 Member of Distinction from SMTA, 2003 Lead Free Co-Operation Award from Soldertec, 2006 Exceptional Technical Achievement Award from CPMT, 2007 Distinguished Lecturer from CPMT, 2009 Distinguished Author from SMTA, and 2010 Electronics Manufacturing Technology Award from CPMT. He served on the board of governors for CPMT, serves on the SMTA board of directors. Among other editorial responsibilities, he serves as editorial advisory board of Soldering and Surface Mount Technology, Global SMT & Packaging and as associate editor for IEEE Transactions on Electronics Packaging Manufacturing. He has numerous publications and frequently gives presentations, invited to seminars, keynote speeches and short courses worldwide on those subjects at international conferences and symposiums.

本课程将涵盖以下主题:
• 软钎料焊点可靠性
热疲劳过程中焊点的结构与性能关系以及失效模式,易脆性和提高可靠性的解决方案
• 电迁移
在无铅,锡铅,铜的支柱,和RDL系统中的基本原理和表现
• POP和底部终止封装
工艺的考虑,材料的选择及可靠性
• 环氧助焊剂 - POP和其他面阵封装中可靠性解决方法
工艺,应用以及与其他替代方案的比较
• 回流焊过程中气孔的控制
气孔产生机制和控制方法以及在QFN中的应用 • Solder Joint Reliability
– Structure-property relationship and failure modes for thermal fatigue, fragility and solutions for reliability improvement
• Electromigration
– Fundamental and performance in SnPb, Pb-free, Cu-pillar, and RDL systems
• PoP & Bottom Terminated Packages
– Process considerations, material selection & reliabilities
• Epoxy Flux – Reliability Solution for PoP and other Area Array Packages
– Process, applications, and comparison with alternative solutions
• Voiding Control at Reflow Soldering
– Voiding mechanisms and control, and application on QFN


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